بحث بيانات أعضاء هيئة التدريس - جامعة الزقازيق

/ بحث بيانات أعضاء هيئة التدريس - جامعة الزقازيق

احمد السيد حسن حماد

الموقع الشخصى
السيرة الذاتية

احمد السيد حسن حماد

الكلية العلوم - القسم الفيزياء

الدرجات العلمية

بكالوريوس فى الفيزياء, -جامعة الزقازيق [2003]
ماجستير فى الفيزياء, -جامعة الزقازيق [2008]
(التركيب الدقيق والخواص الميكانيكية لبعض سبائك اللحام الخالية من الرصاص وعلاقتها بالتشوهات الحرارية)
دكتوراه فى الفيزياء, -جامعة الزقازيق [2010]
(تاثير اضافة الفضة - الانديوم واالنحاس على الخواص الفيزيائية لسبيكة اللحام قصدير - 9 زنك الخالية من الرصاص)

الحالة الوظيفية الحالية :

معار

التدرج الوظيفى الأكاديمى

معيد : 5/11/2003
مدرس مساعد : 30/8/2008
مدرس : 26/10/2010
أستاذ مساعد : 26/12/2017
أستاذ : 24/9/2024

الأبحاث العلمية

1 - Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni (1434).

2 - Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications (1434).

3 - Nano-Lead free solder alloys for electronic packaging and integration (1437).

4 - Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In (1432).

5 - Influence of Zn addition on the microstructure,melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders (1435).

6 - Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions (1434).

7 - Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles (1438).

8 - Enhancement of Fluorescence and Photostability Based on Interaction of Fluorescent Dyes with Silver Nanoparticles for Luminescent Solar Concentrators (1439).

9 - Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In (1432).

10 - Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions (1433).

11 - Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions (1433).

12 - Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 (1435).

13 - Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy (1435).

14 - Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn (1435).

15 - Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles (1438).

16 - Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu leadfree solder by adding trace amount of elements Ni and Sb (1439).

17 - Study The Properties of Sintered Al-Composites Matrix Reinforced With Nano-Al Oxide And/Or Carbon Nano Tubes (1440).

18 - Study The Properties of Sintered Al-Composites Matrix Reinforced With Nano-Al Oxide And/Or Carbon Nano Tubes (1440).

19 - Impact of permanent magnet stirring on dendrite growth and elastic properties of SneBi alloys revealed by pulse echo overlap method (1439).

20 - Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field (1441).

21 - Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field (1441).

22 - Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field (1442).

23 - Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field (1443).

24 - Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy (1443).

25 - Exceptional strength-ductility synergy of Ni and Co-Mg-La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite (1445).

26 - Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy (1445).

27 - Optimization of creep and thermal features of the Sn-Ag-Cu-Zn alloy by the magnetic field (1444).

المجالات البحثية